BSFF Thermal paste, 3.5 g CPU paste heat sink for IC/processor/CPU/all coolers, carbon based high performance

Price: ₹2,490 - ₹539.00
(as of Oct 18, 2025 12:09:10 UTC – Details)

Product Description

The BS-139 compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It can improve that heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking. Superb in performance, BS-139 ranks among the top thermal compound, thermal paste, or thermal grease in the market.

A sustainable use of resources is really important for us at Thus we updated the packaging of the BS-139 to minimize it’s CO2 Footprint.

The computer can work better after using thermal paste. It does not contain any metallic particles, so electrical conductivity would not be an issue. Unlike silver and copper compounds, it can contact any electrical pins that would not damage any sort.

Safe to use: BSFF is metal-free and non-conductive, which eliminates the risk of short circuit and increases the protection of CPU and VGA card.
BETTER THAN LIQUID METAL: It is made of carbon microparticles that guarantee extremely high thermal conductivity. This ensures that the heat from the CPU/GPU is dissipated quickly and efficiently.
HIGH DURABILITY: The BSFF Thermal Paste Edition has excellent heat dissipation performance of the components and has the stability to push the system to the limit.
EXCELLENT PERFORMANCE: Unlike metal and silicone thermal adhesives, BSFF thermal paste is not affected over time. After applying, you do not need to reapply it as it will last for at least 5 years.
Easy to use: BSFF thermal paste has an ideal consistency and is very easy to work with even for beginners