Sadow Thermal Paste for CPU|Thermal Paste for Processor|CPU Thermal Paste|Thermal Paste for Heat Sink|Thermal Grease for CPU, Heat Sink Compound Silicon Conductive for PC CPU GPU Chipset 10g(Pack of 5)

Price: ₹999 - ₹285.00
(as of Nov 10, 2025 14:03:22 UTC – Details)

Product Description

Thermal Grease Paste Compound Silicone for CPU Heat Sink

Thermal coupling of electrical / electronic device to heat sinksHigh Thermal Conductivity:; Low Bleed and Stable at high temperatureSadow silicone-based paste that allows the use of more aluminium in its mix, resulting in better thermal performance and lower operating temperatures.

Feature Features optimum thermal conductivity and low thermal resistance. Simple to use. Transfer the dissipated heat from the components to the heat sink. Can be applied for cooling the interface of heatsink and CPU GPU IC Chips Transistors, etc

Cool Down Quickly

Super thermal conductive silicone grease. Thermal conductivity 5.15 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.

Stability

A special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.

Main Temperature

Main CPU Temperature There is no concern about shorts due to non-conductivity.

Working principle

Filling the gape between heating element and the cooling device, Increasing the contact area so as to achieve the soundest thermal conductivity effect.

The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
Thermal coupling of electrical / electronic device to heat sinks, High Thermal Conductivity, Low Bleed and Stable at high temperature
Notice: – 10 Gm each, the net weight of this silicon grease is 10g, about half a bottle
Graphite Thermal Grease,thermal Conductivity 1.93W/m-k~2.15W/m-k
Thermal conductivity: >0.965 W/m-k Thermal resistance: <0.225°C-in²/W Working temperature range: - 30 ℃~ 180 ℃ Uses: Thermal coupling of electrical device to heatsinks