Chip Quik Thermally Stable Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T4 (50g jar)

Price: ₹9,469 - ₹6,627.00
(as of Nov 27, 2025 16:15:24 UTC – Details)


Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free Sn/Bi/Ag in 50g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product’s stated shelf life.
Solder Paste