FEDUS Silicone Heatsink Compounds Thermal Grease Paste ISOL 6 Heat Sink Compound for CPU and Chipsets Graphics Card LED IC Pack of 5

Price: ₹499 - ₹369.00
(as of Nov 01, 2025 12:45:53 UTC – Details)


This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency, very easy to use, even for beginners.
The possibilities for its application and the most effectively way to avoid voids between CPU and cooler.
Safe Application: It does not contain any metallic particles so electical conductivity would not be an issue.
Unlike silver and copper compound, it ensures that get with any electrical pins would not result in damage of any sort.
High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. A high performance thermal compound perfect for system builders.

• Color: Grey
• Thermal Conductivity:> 1.93W/ m-k
• Thermal resistance:> 0.225
• Operating temperature: -30 to 180 Celsius
• Weight: 30g
• Shelf Life: Two years Notice :
• Thermal conductivity : >0.965 W/m-k
• Thermal resistance : <0.225°C-in²/W
• Working temperature range: – 30 ℃~ 180 ℃

This product has high thermal conductivity, high insulation, high temperature bearing, not easy dried, non-volatile, non-toxic, tasteless, non-corrosive
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, thereby increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C