HM501 Carbon-Based Thermal Compound Paste for Coolers & Heat Sinks – High Performance for CPU & Chipsets (Grey, 30g, Pack of 1)

Price: ₹279 - ₹159.00
(as of Oct 23, 2025 10:04:46 UTC – Details)


This versatile thermal compound paste is ideal for use with all coolers, offering an easy application process thanks to its perfect consistency. Even beginners can apply it with confidence, ensuring there are no voids between the CPU and cooler for maximum heat transfer efficiency. For safe and worry-free application, our thermal paste is free from metallic particles, making it electrically non-conductive—eliminating any concerns about electrical conductivity. Unlike silver or copper-based compounds, it guarantees that no damage will occur to electrical pins. With high thermal conductivity and low thermal resistance, it provides exceptional heat dissipation. Additionally, it is non-curing, non-capacitive, non-corrosive, and bleed-resistant, ensuring long-lasting performance. It can withstand extreme temperatures ranging from -50°C to 210°C, making it a reliable solution for cooling even in the most demanding environments.
High Thermal Conductivity for Efficient Heat Dissipation: Composed of ISOL 6 Heat Sink Compound and carbon micro-particles, this thermal paste provides exceptional heat conductivity. It ensures that heat generated from CPUs, GPUs, and other electrical components is efficiently dissipated, preventing overheating and enhancing overall system performance.
Metal-Free & Electrically Non-Conductive: Unlike traditional thermal pastes, this formula is completely metal-free and electrically non-conductive. This eliminates the risk of short circuits, offering an additional layer of protection to your sensitive components such as the CPU, GPU, and VGA cards. It is ideal for use with delicate and high-performance electronics.
Easy to Apply and Long-Lasting: With its optimal consistency, this thermal paste is very easy to apply—even for beginners. Once applied, it requires no reapplication for years, making it a hassle-free solution for maintaining your system’s cooling efficiency. Its non-curing, non-capacitive, and non-corrosive properties ensure a long-lasting bond between your components and heat sinks.
Temperature Resistance for Extreme Conditions: The thermal paste remains highly effective across a wide range of temperatures, from -50°C to 210°C. Whether you’re dealing with hot summer days or intense usage, it ensures stable heat management for your components even under extreme conditions.
Versatile Application for Various Electronic Devices: This heat sink paste is commonly used for thermal coupling between electrical and electronic devices and heat sinks, such as the base or mounting studs of transistors, diodes, and rectifiers. It helps create a positive heat-sink seal, improving the heat transfer from electronic components to heat sinks or chassis, which in turn increases the overall efficiency and longevity of the device.
Packaging and Specifications: The paste is conveniently packaged in an injection form, ensuring an easy and clean application. Each package contains approximately 30 grams of paste, making it suitable for multiple applications or larger devices that require efficient heat management.