(Pack of 2) Thermal Compound Paste – Carbon Based High Performance – Heatsink Paste – Thermal Compound CPU for All Coolers

Price: ₹499 - ₹209.00
(as of Oct 24, 2025 13:17:42 UTC – Details)

Product Description

Easy to Apply

It has proper viscosity and density is simple and convenient to use and has good consistency whether it is applied by beginners or even with fingers. And it has excellent performance and can continue to maintain good thermal conductivity.

Excellent Performance

This compound thermal paste is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.

Safe Application

It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compounds, it ensures that contact with any electrical pins would not result in damage of any sort.

Graphite Thermal Grease

Good Electric Insulating, Breakdown 10Kv voltage

Low Thermal Impedance, Keep grease condition with long time

With a wide range working temperature, keep stable performance at temperature -30~300 High performance

Cooling device to the end plate heat sink

Low Thermal Impedance

Keep grease condition with long time

With a wide range working temperature, keep stable performance at temperature -30~300 High performance

Use this whenever you’re connecting a component to a heat sink, it’ll really help to dissipate even more potentially damaging heat. This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink.

Features Thermal conductivity > 1.172 W/m-k Thermal Impedance <0.225 Specific Gravity >2.0 Viscosity 1000 Thixotropic Index 380+_10 Viscosity -50~300 Operation Temperature -30~300 Metal Oxide Compounds 20%

Enhanced user experience design

It Is Used For Maintaining A Positive Heat-Sink Seal That Improves Heat Transfer From The Electrical / Electronic Component / Device To The Heat Sink Or Chassis Thereby Increasing The Overall Efficiency Of The Component / Device

It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30g each Injection
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Material : Heat Sink Compound. Color : Grey, Packing Type : Injection, Weight : Approx. 30 g