SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)

Apple Shopping Event

Hurry and get discounts on all Apple devices up to 20%

Sale_coupon_15

2,350.00

14 People watching this product now!
  • Pick up from the Woodmart Store

To pick up today

Free

  • Courier delivery

Our courier will deliver to the specified address

2-3 Days

Free

  • DHL Courier delivery

DHL courier will deliver to the specified address

2-3 Days

Free

  • Warranty 1 year
  • Free 30-Day returns

Payment Methods:

Description

Price: ₹2,350.00
(as of Nov 18, 2025 02:25:39 UTC – Details)


Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA /SMD CPU Repairing(30G )
Essmetuin SAC305 Solder Paste Content: Alloy Tin 96.5%Ag3%Cu0.5%, Solder Flux Content: 10.8%
Lead-Free Solder Paste -High-Temperature Solder Paste With Flux, Melting Point: 217 ℃ (422.6.4F)
Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
High thermal conductivity and conductivity.The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated

Specification

Overview

Processor

Display

RAM

Storage

Video Card

Connectivity

Features

Battery

General

Customer Reviews

0 reviews
0
0
0
0
0

There are no reviews yet.

Be the first to review “SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)”

Your email address will not be published. Required fields are marked *

1 2 3 4 5
1 2 3 4 5
1 2 3 4 5