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₹299.00 Original price was: ₹299.00.₹99.00Current price is: ₹99.00.
To pick up today
Free
Our courier will deliver to the specified address
2-3 Days
Free
DHL courier will deliver to the specified address
2-3 Days
Free
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Price: ₹299 - ₹99.00
(as of Nov 13, 2025 17:09:20 UTC – Details)
Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal grease is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal grease is an example of a thermal interface material. As opposed to thermal adhesive, thermal grease does not add mechanical strength to the bond between heat source and heat sink. It will have to be coupled with a mechanical fixation mechanism such as screws, applying pressure between the two, spreading the thermal grease onto the heat source.
Product Detail: HY510 Thermal Conductivity 1.93 W/m-k Thermal Resistance 0.225 C-in/W
Product Description Being a popular entity, we are providing an inclusive series of Thermal Grease. Our range is extensively employed by our customers owing to high strength and longer life service.
Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type :Round Plastic Box, , Weight : Approx. 10 g Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
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